Large size LCD panel [OLB]

	• Features Fine pitch interconnect : 20 μm fine pitch for TFT-LCD, color STN, EL, High adhesion, high reliability, void-free bonding, and repairable by common solvents. Low bonding temperature and quick bonding time.

Characteristics

Item			TSC5330/40 Series		EMA7870 Series
Pitch size	Line	㎛ (㎛2)	6		10
	Space	㎛	14		10
Conductiveparticle	Type	-	Au/Ni/polymer or Ni/Polymer
	Size	㎛	3/4	3
	Density	pcs/㎜2	5500/7000	6000
Main-bonding condition	Temp.	℃	150±20	170±20
	Time	sec.	≥4	≥4
	Pressure	MPa	3~5	3~5