• Features- High adhesion for Ceramic&FR-4 substrate- Good contact resistance for reliability - Easy rework for TCM&EMA&TOF series - Burr decrease effectiveness for TCM series |
Item | TSB2000 Series | TCM5000 Series | EMA1271 Series | TOF5000 Series | |||
---|---|---|---|---|---|---|---|
Pitch size | Line | ㎛ | 10㎛ ball (75) , 20㎛ (125) | ||||
Space | ㎛ | 10㎛ ball (75) , 20㎛ (125) | |||||
Conductiveparticle | Type | - | Au/Ni/Polymer | ||||
Size | ㎛ | 10/20 | |||||
Density | pcs/㎜2 | 1200/300 | |||||
Main-bonding condition | Temp. | ℃ | 190±10 | 150±10 | 150±20 | 155±5 | |
Time | sec. | ≥7 | ≥10 | ≥7 | ≥10 | ||
Pressure | MPa | 1~3 |