Fingerprint recognition Module

	• Features - Low Temperature - Waterproof, - Pb Free

Characteristics

Item				TGP5010 Series	TSB20522F Series	TCM5022 Series
Pitch size	Line	㎛		75	125	125
	Space	㎛		75	125	125
Conductiveparticle	Type		-	Au/Ni/Polymer	Au/Ni/Polymer + Metal
	Size		㎛	10	20 + 8
	Density		Pcs/mm²	800	200 &500	200 &350
Main-bonding condition	Temp.		℃	140 ~ 200	180 ~ 200	130 ~ 180
	Time		sec.	≥ 4	≥7	≥6
	Pressure		MPa	1.5 ~ 2.5	1.5 ~ 2.5	1 ~ 3