COG

	• Features Fine pitch interconnection : min. 6㎛ gap for COG application Minimum connecting area of bump: 800㎛2. High reliability and adhesion property.

Characteristics

Item			TCG1031/41 Series	TCG9031/41 Series
Pitch size	Line	㎛ (㎛2)	1200㎛2	800㎛2
	Space	㎛	10	6
Conductiveparticle	Type	-	Au/Ni/polymer or Ni/Polymer
	Size	㎛	3/4
	Density	pcs/㎜2	45000	60000
Main-bonding condition	Temp.	℃	210±20	155±20
	Time	sec.	≥5
	Pressure	MPa	3~540~100 (per bump area of IC)