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Camera Module (FOF)

• Features

- High adhesion for Ceramic&FR-4 substrate
- Good contact resistance for reliability
- Easy rework for TCM&EMA&TOF series
- Burr decrease effectiveness for TCM series

Characteristics
Item TSB2000 Series TCM5000 Series EMA1271 Series TOF5000 Series
Pitch size Line 10㎛ ball (75) , 20㎛ (125)
Space 10㎛ ball (75) , 20㎛ (125)
Conductiveparticle Type - Au/Ni/Polymer
Size  10/20
Density pcs/㎜2 1200/300
Main-bonding condition Temp. 190±10 150±10 150±20 155±5
Time sec. ≥7 ≥10 ≥7 ≥10
Pressure MPa 1~3