• FeaturesHigh adhesion, high reliability, void-free bonding, and repairable by common solvents.Applicable for fine pitch OLED with shorter bonding times. High reliability and adhesion property. |
Item | TSC22000 Series | ||
---|---|---|---|
Pitch size | Line | ㎛ (㎛2) | 25 |
Space | ㎛ | 25 | |
Conductiveparticle | Type | - | Ni/Polymer or Ni |
Size | ㎛ | 5 | |
Density | pcs/㎜2 | 4500 | |
Main-bonding condition | Temp. | ℃ | 190±10 |
Time | sec. | >8 | |
Pressure | MPa | 2.5~3 |