Application | UNDERFILL-PACKAGING | UNDERFILL- MODULE &COF | PCB REWORK | HOUSING ATTACH | ||
---|---|---|---|---|---|---|
Item | Test method | MRH0310N | MRH0110U | MRH0312L | MRH0711E | |
Appearance | Uncured | naked eye | Black viscous liquid | Black viscous liquid | Green viscous liquid | Black viscous liquid |
Cured | naked eye(@ surface) | No blisters and cracks | No blisters and cracks | No blisters and cracks | No blisters and cracks | |
Viscosity | Rheometer(@25℃) | 14,000cPs | 600 ~ 900cPs | 19,500cPs | 35,000cPs | |
Thixotropic Index | 1.3 | 1.0 ~ 1.1 | 1.6 | 5.1 | ||
Gelation time | @ Tack free | 80 ± 10 s | 80 ± 10 s | 90 ± 10 s | - | |
Adhesion strength | Shear strength | >270kgf/㎠(Die shear) | 336.6kgf/㎠ | 350kgf/㎠ | 3.2kgf/㎠(LCP/ FPCB) | |
Modulus | DMA(@30℃) | 3.2 GPa | 2.4 GPa | 2.7GPa | 0.06GPa | |
Tg | TMA | 130℃ | 126℃ | 127℃ | 100℃ | |
CTE | α’(ppm/℃) | 50 ppm/℃ | 60 ppm/℃ | 55 ppm/℃ | 68 ppm/℃ | |
α’’(ppm/℃) | 175 ppm/℃ | 195 ppm/℃ | 190 ppm/℃ | 1187 ppm/℃ |